International Conference on Electronics Packaging Technology ICEPT on October 07-08, 2026 in New York, United States
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- Short Name: ICEPT
- Event Type: Conference
- Presentation: Physical
- Website URL: https://waset.org/electronics-packaging-technology-conference-in-october-2026-in-new-york
- Program URL: https://waset.org/conferences-in-october-2026-in-new-york/program
- Contact URL: https://waset.org
- Location: New York, United States
- Date: October 07-08, 2026
- Final Submission: September 09, 2026
- Notification: December 08, 2025
- Organization: World Academy of Science, Engineering and Technology
- Conference Tags: thermal stresses electronic materials polymer materials nanotechnology nanomaterials nanocomposites microstructure functional coatings composite materials ceramic materials advanced materials
Electronics packaging technology
Advanced packaging
TSV/WAFER level packaging
Interconnection technologies
Emerging packaging technologies
Materials and substrates/leadframes
Processes and automation/equipments
Electrical modeling and simulations
Mechanical modeling and simulations
Thermal characterization and cooling solutions
Quality and reliability
Sheet metal
Cast metal
Machined metal
Molded plastic
Potting
Porosity sealing or impregnation
Liquid filling
Conformal coating
Glop-top
Hermetic metal/glass cases
Hermetic ceramic packages
Printed circuit assemblies
Advanced packaging
TSV/WAFER level packaging
Interconnection technologies
Emerging packaging technologies
Materials and substrates/leadframes
Processes and automation/equipments
Electrical modeling and simulations
Mechanical modeling and simulations
Thermal characterization and cooling solutions
Quality and reliability
Sheet metal
Cast metal
Machined metal
Molded plastic
Potting
Porosity sealing or impregnation
Liquid filling
Conformal coating
Glop-top
Hermetic metal/glass cases
Hermetic ceramic packages
Printed circuit assemblies
Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE
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