International Conference on Electronics Packaging Technology ICEPT on October 07-08, 2026 in New York, United States

Name: International Conference on Electronics Packaging Technology
Start: 2026-10-07T00:00:00.000000Z
End: 2026-10-08T00:00:00.000000Z
Location: New York, United States

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Short Name: ICEPT
Event Type: Conference
Website URL: https://waset.org/electronics-packaging-technology-conference-in-october-2026-in-new-york
Program URL: https://waset.org/conferences-in-october-2026-in-new-york/program
Contact URL: https://waset.org
Location: New York, United States
Date: October 07-08, 2026
Final Submission: September 09, 2026
Notification: December 08, 2025
Organization: World Academy of Science, Engineering and Technology
Conference Tags: thermal stresses electronic materials polymer materials nanotechnology nanomaterials nanocomposites microstructure functional coatings composite materials ceramic materials advanced materials

Description
Organization

Electronics packaging technology
Advanced packaging
TSV/WAFER level packaging
Interconnection technologies
Emerging packaging technologies
Materials and substrates/leadframes
Processes and automation/equipments
Electrical modeling and simulations
Mechanical modeling and simulations
Thermal characterization and cooling solutions
Quality and reliability
Sheet metal
Cast metal
Machined metal
Molded plastic
Potting
Porosity sealing or impregnation
Liquid filling
Conformal coating
Glop-top
Hermetic metal/glass cases
Hermetic ceramic packages
Printed circuit assemblies

Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE

World Academy of Science, Engineering and Technology is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program.

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