International Conference on Microlectronics, Electronic Components, Materials and Technology ICMECMT on September 09-10, 2026 in Singapore, Singapore

Microlectronics, Electronic Components, Materials and Technology
Silicon Microsystems and MEMS
Thin Film Transistors
Flexible Electronics and Micro/Nano Electronics System Integration and Reliability
Microlectronics, Electronic Components and Technology
Advanced Packaging
3D technologies, embedded, wafer and panel level
packaging, flip chip, advanced substrates, interposers, novel assembly technologies,
fan-out, internet-of-things, bio-compatible, wearables, TSVs, MEMS and sensors,
heterogeneous integration, electronic (power and RF) and optoelectronic packaging

Applied Reliability
System level reliability testing/modeling, reliability test methods
and life models, failure analysis techniques/physics of failure, TSV/3D reliability and
packaging challenges, interconnect reliability, solder and materials characterization, drop
and dynamic mechanical reliability, probabilistic design for reliability (PDfR), automotive
reliability requirements

Assembly and Manufacturing Technology
Advancement of packaging
and manufacturing technologies in large OEMs, innovation in enabling high density
packages including 3D integration, challenges and solutions of mainstream packaging and
manufacturing technologies, challenges and solutions for medical applications

Emerging Technologies
Internet-of-things components: wearable electronics,
flexible and stretchable electronics packaging, compact and autonomous sensor packaging;
bioelectronics packaging: microfluidics and MEMS, bio-sensing packaging, new
materials for bio packaging; power technologies: small form factor packaging, high
power packaging; novel advanced packaging: energy harvesting electronics packaging,
photovoltaic packaging, components for wireless packaging, novel approaches to
packaging; complex packaging: security, redundancy, repair, directed assembly, built-in
test, multifunction integration; emerging packaging concepts and technologies: organic IC
and TFT, anti-counterfeiting packaging

High-Speed, Wireless and Components
Components, modules and novel
packaging technology solutions for high-frequency, high-speed digital, power, and wireless
applications; embedded/integrated chips and passives; signal and power integrity; sensors,
RFID, RF MEMS, low-power RF design, wireless power transfer and energy harvesting;
cutting-edge component/module technologies for power, RF, millimeter-wave and THz
applications; bio/wearable applications, flexible and printed electronics; meta-materials,
magneto-dielectric nano-composites; SiP, heterogeneous integration

Interconnections
First- and second-level interconnections: designs, structures,
processes, performance, reliability (e.g., electromigration), test; technologies including
TSV, interposers (Si, glass, organic), interconnections for 3D integration and SiP, flip chip,
solder bumping and Cu pillar, wafer-level packaging, wafer and panel level fan-out,
advanced wirebonds, non-traditional interconnections (e.g., electrically conductive
adhesives, carbon nano-tubes, graphene, optical), substrates and PCB solutions for next
generation systems, system packaging and heterogeneous integration; topics of special
interest include new applications in wearables, internet-of-things, cloud, and automotive
electronics

Materials and Processing
Adhesives and adhesion, lead free solder, novel materials
and processing; underfills, mold compounds, dielectrics, emerging materials, and
processing for 2D and 3D

Modeling and Simulation
Electrical, thermal and mechanical modeling and simulation,
including: component, board and system level modeling for microelectronics including
3D interconnects (TSV, stacked die), 2.5D packaging (Si interposers), wafer-level
package (WLP), ball grid array (BGA), embedded packages with active and passive
components, system-in-package (SiP), power electronic modules, LED packaging,
MEMS; novel high-speed interconnects and power delivery architectures; fab/thin wafer
handling, wire bonding and assembly manufacture process; reliability modeling related
fracture mechanics, fatigue, electromigration, warpage, delamination/moisture, drop
test, material constitutive relations; novel modeling including multi-scale and multi-physics
techniques and solutions; measurement methodologies and correlations

Optoelectronics
Fiber optical interconnects, single mode or multicore connectors,
parallel optical transceivers, silicon and III-V photonics packaging, optical chip-scale and
heterogeneous integration, micro-optical system integration and photonic system-in-
package, 3D photonics integration, optoelectronic assembly and reliability, materials and
manufacturing technology, high-efficiency LEDs and high power lasers, integrated optical
sensors