International Congress on Electrical, Electronics and Intelligent Systems LCEEIS on August 18-20, 2026 in Lisbon, Portugal - Conference Index

International Congress on Electrical, Electronics and Intelligent Systems LCEEIS on August 18-20, 2026 in Lisbon, Portugal

International Congress on Electrical, Electronics and Intelligent Systems (LCEEIS) August 18, 2026 - Lisbon, Portugal

31st LISBON International Congress on Electrical, Electronics and Intelligent Systems (LCEEIS-26) scheduled on Aug. 18-20, 2026 Lisbon (Portugal) is for the engineers, practitioners, scientists, researchers, scholars, and students from all around the world and it also includes the industry people to present ongoing research activities, and hence to foster research relations between Academia and industry. The conference is being organized by Emirates Research Publication (ERPUB) operting under Pilares D Elegancia LDA (Portugal). This conference provides opportunities for the delegates to share new ideas and application experiences face to face, to establish business or research relations and to find global partners for future collaboration. All the submitted conference papers will be peer reviewed by the program/technical committees of the Conference. 

Call for papers/Topics

Topics of Interest for Submission include, but are Not Limited to:

1. Power Systems and Energy Technologies

The "Independent" foundation of electrical engineering, focusing on the generation, transmission, and management of electricity.

Smart Grid Infrastructure

Microgrids and Distributed Energy Resources (DER)

Vehicle-to-Grid (V2G) Integration

Self-healing Grids and Fault Detection

Renewable Energy Integration

Advanced Photovoltaic Systems

Wind Turbine Control and Optimization

Hybrid Energy Systems (Solar-Wind-Hydro)

Power Electronics

Wide Bandgap Semiconductors (GaN and SiC)

High-Efficiency Inverters and Converters

Wireless Power Transfer (Inductive and Capacitive)

Energy Storage

Solid-State Battery Management Systems (BMS)

Supercapacitors and Thermal Storage

Grid-scale Battery Intelligence

2. Electronics and Microelectronics

The "Independent" physical hardware layer that powers all modern computing and communication.

Semiconductor Engineering

Heterogeneous Integration (Chiplets and Die-Stacking)

Advanced Lithography and Nano-fabrication

Flexible and Organic Electronics

Integrated Circuits (IC) Design

System-on-Chip (SoC) for Edge AI

Mixed-Signal and Analog Circuit Design

Radiation-Hardened Electronics for Space

Optoelectronics and Photonics

Silicon Photonics for Data Centers

Laser Diode Technology

Quantum Photonic Integrated Circuits

Sensors and Actuators

MEMS/NEMS (Micro/Nano-Electro-Mechanical Systems)

Biosensors and Wearable Health Monitors

Smart Actuators for Soft Robotics

3. Intelligent Systems and Robotics

The "Interrelated" intelligence layer that interprets data and executes autonomous actions.

Artificial Intelligence and Machine Learning

Deep Learning for Signal and Image Processing

Reinforcement Learning for Industrial Control

Neuromorphic Computing (Brain-inspired Hardware)

Robotics and Autonomous Systems

Embodied AI (Large Action Models)

Collaborative Robots (Cobots) for Manufacturing

Swarm Robotics and Multi-UAV Coordination

Human-Machine Interaction (HMI)

Brain-Computer Interfaces (BCI)

Augmented Reality (AR) in Maintenance

Gesture and Voice-Controlled Systems

4. Communication and Networking

The "Interrelated" connective tissue linking hardware to intelligent systems.

Advanced Wireless Systems

6G Research and Terahertz (THz) Communication

Software-Defined Networking (SDN)

Massive MIMO and Beamforming

Internet of Things (IoT) and Industry 4.0

Industrial IoT (IIoT) and Predictive Maintenance

Edge Computing and Fog Networking

Digital Twins of Electrical Infrastructure

Quantum Information Systems

Quantum Key Distribution (QKD) for Security

Quantum Sensing and Metrology

Entanglement-based Networking

5. Interdisciplinary and Interrelated Domains

Where all three fields merge to solve complex global challenges.

Cyber-Physical Systems (CPS)

Security for Critical Power Infrastructure

Real-time Embedded Control Systems

Hardware Security and Trusted Computing

Sustainable and Green Technology

Energy-Efficient AI (TinyML)

Carbon-Neutral Electronics Manufacturing

Electronic Waste Recycling and Circular Design

Biomedical Engineering

Neural Engineering and Neural Prosthetics

Smart Medical Implants

Telehealth Sensing Systems

Name: EARET
Website: http://earet.org

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