World Congress on Semiconductor Technologies, AI & Intelligent Electronics WCSTAI on September 09-11, 2026 in Seoul, Republic of Korea
Volunteer Application
- Short Name: WCSTAI
- Event Type: Conference
- Website URL: https://conferencesglobal.org/SemiconductorAI/
- Program URL: https://conferencesglobal.org/SemiconductorAI/program
- Contact E-mail: [email protected]
- Location: Seoul, Republic of Korea
- Venue: Grand Hyatt Seoul
- Date: September 09-11, 2026
- Final Submission: August 28, 2026
- Notification: April 10, 2026
- Organization: Conferences Global
- Conference Tags: semiconductors semiconductor technology power semiconductor devices semiconductor manufacturing artificial intelligence nanoelectronics nanoelectrochemistry smart materials nanoparticles
The 9th World Congress on Semiconductor Technologies, AI & Intelligent Electronics (WCSTAI 2026) is a premier international forum focused on next-generation chips, integrated circuits, AI hardware acceleration, advanced packaging, materials, and intelligent electronic systems. Hosted in Seoul, South Korea, the congress brings together researchers, engineers, and industry leaders to share breakthroughs and practical innovations shaping semiconductor manufacturing and AI-enabled electronics.
Across three days of keynotes, technical sessions, exhibitions and networking, participants will explore:
Semiconductor device physics, materials, and process technology
IC design, VLSI, EDA, and hardware security
AI/ML acceleration, edge AI chips, neuromorphic and in-memory computing
Advanced packaging, heterogeneous integration, lithography and metrology
Power electronics, wide bandgap semiconductors, and intelligent power systems
Whether you are from academia, a fab, a foundry ecosystem, a system OEM, or a deep-tech startup, WCSTAI 2026 offers a global platform to present your work, build collaborations, and connect with sponsors, exhibitors, investors and technology partners.
Semiconductor device physics, materials, and process technology
IC design, VLSI, EDA, and hardware security
AI/ML acceleration, edge AI chips, neuromorphic and in-memory computing
Advanced packaging, heterogeneous integration, lithography and metrology
Power electronics, wide bandgap semiconductors, and intelligent power systems
Name: Conferences Global
Website: https://conferencesglobal.org/
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