International Symposium on Integrated Circuit Design and Integrated Systems on September 26-28, 2025 in Yishun New Town, Singapore
- Event Type: Conference
- Presentation: Hybrid
- Website URL: http://www.icdisconf.com/
- Location: Yishun New Town, Singapore
- Date: September 26-28, 2025
- Notification: July 31, 2025
- Organization: University of Campinas
- Conference Tags: semiconductor technology photonics electronic circuits and systems electronic circuits integrated circuits
The 2nd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2025) will be held in Singapore during September 26-28, 2025.
The conference will provide a platform for all industry insiders and scholars from all over the world, where researchers, engineers and students from industry, universities and government institutions will present their latest work and discuss many applications of Integrated circuit design and integrated systems.
The Technical Committee of the 2nd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2025) invites the submission of original research papers in the fields of integrated circuit design and integrated systems to be published in the conference proceedings. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. Accepted papers will be presented as either oral or poster at the conference. Accepted papers will be published by ACM, which will be sent to EI Compendex, Scopus for indexing service. Contributions are sought in the following areas:
Analog, Digital, Mixed, and RF Circuits Design
Low Power Tools and Designs Techniques
Photonic Integrated Circuits (PIC) Design and Optimization
CMOS-Compatible Photonic Devices and Applications CMOS
Photonic Integrated Chips and Photonic Integrated Technology
Combinatorial Logic Gate CMOS
Memory and Array Structure Design
VLSI Design
Advanced Materials for Photonic and Optoelectronic Devices
Silicon / Germanium Devices and Device Physics
Modeling and Simulation of Organic Semiconductor Devices
Test, Fault Tolerance, Reliability and Modelling
Interconnect, Low K, High K and Other Process Technologies
Integrated Circuits CAD, DFM
Signal Processing Techniques for Hybrid Photonic-Electronic Systems
Highly Integrated Front-end Circuits and Devices
Integrated Circuits for Optical Communications
Physical Design of Optoelectronic Integration Circuits and systems
Devices and Circuits for Wireless Systems
Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing
Manufacturing, Processing, Packaging and Testing Technology of Optoelectronic Integration and Devices
Electronic Design Automation (EDA)
Data Path in Digital Processor Architecture
Embedded/Multiprocessor Systems
Hardware-Software Co-Design and Co-Verification
Name: University of Campinas
Description | Price | Date |
---|---|---|
Author (Including 1 paper registration fee) | USD 450.00 | Before June 30, 2025 |
Author (Including 1 paper registration fee) | USD 500.00 | After June 30, 2025 |
Presenter/Listener (Including 1 participation fee) | USD 350.00 | Before August 31, 2025 |
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