International Symposium on Integrated Circuit Design and Integrated Systems on September 26-28, 2025 in Yishun New Town, Singapore

International Symposium on Integrated Circuit Design and Integrated Systems on September 26-28, 2025 in Yishun New Town, Singapore

The 2nd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2025) will be held in Singapore during September 26-28, 2025.

The conference will provide a platform for all industry insiders and scholars from all over the world, where researchers, engineers and students from industry, universities and government institutions will present their latest work and discuss many applications of Integrated circuit design and integrated systems.

The Technical Committee of the 2nd International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS 2025) invites the submission of original research papers in the fields of integrated circuit design and integrated systems to be published in the conference proceedings. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. Accepted papers will be presented as either oral or poster at the conference. Accepted papers will be published by ACM, which will be sent to EI Compendex, Scopus for indexing service. Contributions are sought in the following areas:

Analog, Digital, Mixed, and RF Circuits Design

Low Power Tools and Designs Techniques

Photonic Integrated Circuits (PIC) Design and Optimization

CMOS-Compatible Photonic Devices and Applications CMOS

Photonic Integrated Chips and Photonic Integrated Technology

Combinatorial Logic Gate CMOS

Memory and Array Structure Design

VLSI Design

Advanced Materials for Photonic and Optoelectronic Devices

Silicon / Germanium Devices and Device Physics

Modeling and Simulation of Organic Semiconductor Devices

Test, Fault Tolerance, Reliability and Modelling

Interconnect, Low K, High K and Other Process Technologies

Integrated Circuits CAD, DFM

Signal Processing Techniques for Hybrid Photonic-Electronic Systems

Highly Integrated Front-end Circuits and Devices

Integrated Circuits for Optical Communications

Physical Design of Optoelectronic Integration Circuits and systems

Devices and Circuits for Wireless Systems

Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing

Manufacturing, Processing, Packaging and Testing Technology of Optoelectronic Integration and Devices

Electronic Design Automation (EDA)

Data Path in Digital Processor Architecture

Embedded/Multiprocessor Systems

Hardware-Software Co-Design and Co-Verification

Name: University of Campinas

Description Price Date
Author (Including 1 paper registration fee) USD 450.00 Before June 30, 2025
Author (Including 1 paper registration fee) USD 500.00 After June 30, 2025
Presenter/Listener (Including 1 participation fee) USD 350.00 Before August 31, 2025
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