International Symposium on Integrated Circuit Design and Integrated Systems on November 22-24, 2024 in Xiamen, China
- Event Type: Conference
- Presentation: Hybrid
- Website URL: http://www.icdisconf.com/
- Program URL: http://www.icdisconf.com/program.html
- Contact URL: http://www.icdisconf.com/contact.html
- Contact E-mail: [email protected]
- Location: Xiamen, China
- Venue: Millennium Harbourview Hotel Xiamen
- Date: November 22-24, 2024
- Notification: October 20, 2024
- Organization: University of Campinas
- Conference Tags: electronic circuits and systems integrated optics electronic circuits integrated circuits circuits
2024 International Symposium on Integrated Circuit Design and Integrated Systems (ICDIS2024) will be held in Xiamen, China during November 22-24, 2024. The conference will provide a platform for all industry insiders and scholars from all over the world, where researchers, engineers and students from industry, universities and government institutions will present their latest work and discuss many applications of Integrated circuit design and integrated systems.
ICDIS2024 invites the submission of original research papers in the fields of theoretical, experimental, and applied cyber security and information engineering to be published in the conference proceedings. Each submission is anonymously reviewed by an average of three independent reviewers, to ensure the final high standard and quality of submitted papers. All accepted and registered papers will be included in International Conference Proceedings, which will be published by ACM, and sent to EI Compendex and Scopus for indexing.
Analog, Digital, Mixed, and RF Circuits Design
Low Power Tools and Designs Techniques
Sequential Logic Circuit Design
Design of CMOS Combinatorial Logic Gate CMOS
Memory and Array Structure Design
VLSI Design
Silicon / Germanium Devices and Device Physics
Modeling and Simulation of Organic Semiconductor Devices
Test, Fault Tolerance, Reliability and Modelling
Interconnect, Low K, High K and Other Process Technologies
Integrated Circuits CAD, DFM
Signal De-Noise and Processing and Optimization
Highly Integrated Front-End Circuits and Devices
Integrated Circuits for Communications
Physical Design of Integrated Circuits and Systems
Devices and Circuits for Wireless Systems
Devices, Hardware and Methods for Bio-Inspired and Neuromorphic Computing
Manufacturing, Processing, Packaging and Testing Technology of Integrated Circuits and Devices
Electronic Design Automation (EDA)
Data Path in Digital Processor Architecture
Embedded / Multiprocessor Systems
Hardware-Software Co-Design and Co-Verification
Name: University of Campinas
Description | Price | Date |
---|---|---|
Full Registration (Including 1 paper registration fee and 1 participation fee) | USD 570.00 | Before November 15, 2024 |
Author (Including 1 paper registration fee) | USD 500.00 | Before November 15, 2024 |
Listener (Including 1 participation fee) | USD 150.00 | Before November 15, 2024 |
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