International Symposium on Industrial Embedded Systems on October 23-25, 2024 in Chengdu, China
- Event Type: Conference
- Presentation: Physical
- Website URL: https://ieee-sies.org/
- Program URL: https://ieee-sies.org/program.html
- Contact URL: https://ieee-sies.org/contact.html
- Contact E-mail: [email protected]
- Location: Chengdu, China
- Date: October 23-25, 2024
- Final Submission: September 10, 2024
- Organization: czesnd
- Conference Tags: industrial virtual reality industrial electronics industrial automation industrial engineering industrial
Conference Proceedings:
All the accepted regular full papers will be included in IEEE Conference Proceedings and submitted for Ei Compendex & Scopus index.
Conference History:
The SIES series were hosted by:
- University of Nice Sophia Antipolis, France (2006)
- Uninova, Portugal (2007)
- LIRMM/CNRS, France (2008)
- Ecole Polytechnique Fédérale de Lausanne, Switzerland (2009)
- University of Trento, Italy (2010)
- Malardalen University, Sweden (2011)
- Karlsruhe Institute of Technology, Germany (2012)
- Polytechnic Institute of Porto, Portugal (2013)
- Scuola Superiore S. Anna, Italy (2014)
- Siegen University, Germany (2015)
- AGH UST, Poland (2016)
- France (2017)
- Graz University of Technology, Austria (2018)
SIES Awards:
- OUTSTANDING PAPER AWARD
- BEST REVIEWER AWARD
- BEST PAPER AWARD
- BEST WIP PAPER AWARD
- BEST PRESENTATION AWARD
Contact:
Conference Secretary: Ms. Amy J.Y.Hu
Email: [email protected]
Call for papers:
Topics of interest include, but are not limited to:
- EMBEDDED SYSTEMS
- SYSTEM-ON-CHIP AND NETWORK-ON-CHIP DESIGN & TESTING
- NETWORKED EMBEDDED SYSTEMS AND EDGE COMPUTING
- EMBEDDED APPLICATIONS
Name: czesnd
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