International Conference on VLSI ICVLSI on December 13-14, 2025 in Vientiane, Laos
Submit Your Paper- Short Name: ICVLSI
- Event Type: Conference
- Presentation: Physical
- Website URL: https://waset.org/vlsi-conference-in-december-2025-in-vientiane
- Program URL: https://waset.org/conferences-in-december-2025-in-vientiane/program
- Contact URL: https://waset.org
- Location: Vientiane, Laos
- Date: December 13-14, 2025
- Final Submission: November 15, 2025
- Notification: October 01, 2024
- Organization: World Academy of Science, Engineering and Technology
- Conference Tags: graphics hardware microfabrication microprocessors computer architecture
VLSI technology, systems and application
Very-large-scale integration technology
Low power CMOS and embedded memory
Foundry technology
RF process, device and integration technology
Standalone memory: DRAM, FLASH, emerging memory technology
Advanced process modules
Nanopatterning: Multiple patterning, directed self-assembly, EUV, etc.
Power and analog IC device and technology
Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAA, 2D materials/1D nanowires
Material, process and device modeling
TFT and organic electronics
MEMS, imagers and sensors
Advanced manufacturing technology, metrology and yield
Reliability physics, characterization and test
Advanced packaging and 2.5D/3D Integration
Photonics and Beyond CMOS Technology
Energy harvesting technology
Wearable and loE enabling technologies
Very-large-scale integration technology
Low power CMOS and embedded memory
Foundry technology
RF process, device and integration technology
Standalone memory: DRAM, FLASH, emerging memory technology
Advanced process modules
Nanopatterning: Multiple patterning, directed self-assembly, EUV, etc.
Power and analog IC device and technology
Advanced CMOS process and devices: Ge, SiGe, III-V, FinFET, GAA, 2D materials/1D nanowires
Material, process and device modeling
TFT and organic electronics
MEMS, imagers and sensors
Advanced manufacturing technology, metrology and yield
Reliability physics, characterization and test
Advanced packaging and 2.5D/3D Integration
Photonics and Beyond CMOS Technology
Energy harvesting technology
Wearable and loE enabling technologies
Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE
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