International Conference on Thermal, Mechanical and Multiphysics Engineering ICTMME on February 15-16, 2024 in Bogota, Colombia
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- Short Name: ICTMME
- Event Type: Conference
- Presentation: Physical
- Website URL: https://waset.org/thermal-mechanical-and-multiphysics-engineering-conference-in-february-2024-in-bogota
- Program URL: https://waset.org/conferences-in-february-2024-in-bogota/program
- Contact URL: https://waset.org
- Location: Bogota, Colombia
- Date: February 15-16, 2024
- Final Submission: January 14, 2024
- Notification: August 30, 2023
- Organization: World Academy of Science, Engineering and Technology
- Conference Tags: mechanical engineering physics engineering
Thermal, Mechanical and Multiphysics
Simulation and Experiments
in Micro/Nanoelectronics and Systems
Multi-physics simulation (thermal, mechanical, thermo-
mechanical, coupled thermo-fluidic, coupled electro-mechanics,
fluid structure interactions, opto-mechanics)
Failure analysis and failure mode extraction
Material characterisation, experiments and modelling
Validation of simulations by experiments
Failure criteria and damage modelling for reliability prediction
Integrated process modelling
Advanced numerical and analytical simulation methodologies
and tools
Behavioural modelling
Simulation-based optimisation, virtual prototyping in product
and/or process design
Compact modelling and model order reduction
Multiscale modeling and simulation
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems
Applications
Components and packaging
Flip-chip, BGA, CSP, Wafer-Level packages, MCM, Cu/low-k packages
3-D packaging
Opto-electronic packages
High temperature and high power packaging
Packaging for harsh environments
Microsystems
Piezoelectric components
MEMS sensors and actuators
Opto-mechanical devices
Nano-electronic mechanical devices
Bio-MEMS/NEMS
Microfluidics
LED lighting
Smart systems
Thermal, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems
Simulation and Experiments
in Micro/Nanoelectronics and Systems
Multi-physics simulation (thermal, mechanical, thermo-
mechanical, coupled thermo-fluidic, coupled electro-mechanics,
fluid structure interactions, opto-mechanics)
Failure analysis and failure mode extraction
Material characterisation, experiments and modelling
Validation of simulations by experiments
Failure criteria and damage modelling for reliability prediction
Integrated process modelling
Advanced numerical and analytical simulation methodologies
and tools
Behavioural modelling
Simulation-based optimisation, virtual prototyping in product
and/or process design
Compact modelling and model order reduction
Multiscale modeling and simulation
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro/Nano-Electronics and Micro/Nano-systems
Applications
Components and packaging
Flip-chip, BGA, CSP, Wafer-Level packages, MCM, Cu/low-k packages
3-D packaging
Opto-electronic packages
High temperature and high power packaging
Packaging for harsh environments
Microsystems
Piezoelectric components
MEMS sensors and actuators
Opto-mechanical devices
Nano-electronic mechanical devices
Bio-MEMS/NEMS
Microfluidics
LED lighting
Smart systems
Thermal, mechanical and multiphysics simulation and experiments of micro/nano-electronics and microsystems
Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE