International Conference on Solid-State and Integrated Circuit Technology ICSICT on October 27-30, 2026 in Hangzhou, China

Co-sponsored by

IEEE China Council, IEEE Beijing Section, Zhejiang University, University of Electronic Science and Technology of China, Wuhan University of Technology, Sichuan Institute of Electronics

Technically Co-sponsored by

IEEE Nanjing Section, Fudan University

Hosted by

College of Integrated Circuits, Zhejiang University

Yangtze Delta Region Institute (Huzhou), University of Electronic Science and Technology of China

Supported by

Peking University, Shanghai Jiao Tong University, Nanjing University of Posts and Telecommunications, IEEE Microwave Theory & Technology Society Hangzhou Chapter

Media Partner

Semi-insights, EETOP, semi-news

Committee

Life Honorary Chair

Yangyuan Wang, Peking University, China

Advisory Committee Co-Chairs

Ting-Ao Tang, Fudan University, China

Cor Claeys, Proximus, Belgium

Mengqi Zhou, IEEE China Council, China

General Chairs

Jan Van der Spiegel, University of Pennsylvania, USA

Bin Zhao, IEEE EDS, USA

Francois Rivet, University of Bordeaux, France

Amara Amara, International Innovation Institute, Beihang University, Hangzhou Campus, China

General Co-Chairs

Ning Xu, Wuhan University of Technology, China

Cheng Zhuo, Zhejiang University, China

Yuehang Xu, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Gaofeng Wang, Hangzhou Dianzi University, China

Technical Program Committee Chairs

Haruo Kobayashi, Gunma University, Japan

Ming Li, Peking University, China

Bo Zhang, University of Electronic Science and Technology of China, China

Yi Zhao, Huada Semiconductor, China

Technical Program Committee Co-Chairs

Bei Yu, The Chinese University of Hong Kong, China

Zheng Wang, University of Electronic Science and Technology of China, China

Fakhrul Zaman Rokhani, Universiti Putra Malaysia, Malaysia

Ling Zhang, Zhejiang University, China

Yuchao Yang, Peking University, China

Jing Jin, Shanghai Jiao Tong University, China

Wentong Zhang, University of Electronic Science and Technology of China, China

Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Local Arrangement Chair

Letian Huang, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Subcommittee Chairs

Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Wentong Zhang, University of Electronic Science and Technology of China, China

Jing Jin, Shanghai Jiao Tong University, China

Yuchao Yang, Peking University, China

Subcommittee Co-Chairs

Hailong Jiao, Peking University, China

Zheng Wang, University of Electronic Science and Technology of China, China

Jin Wei, Peking University, China

Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Competition Chairs

Ying Wang, Institute of Computing Technology, CAS, China

Xiangyu Mao, University of Electronic Science and Technology of China, China

Hanru Shao, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Special Session Chairs

Haimeng Huang, University of Electronic Science and Technology of China, China

Kechao Tang, Peking University, China

Tutorial Chairs

Wei Mao, Xidian University, China

Hua Fan, University of Electronic Science and Technology of China, China

Regional Chair

Lobna Said, Nile University, Egypt

Industry Liaison Chairs

Liguang Chen, Shanghai Anlogic Infotech Co., Ltd., China

Sylvain Eimer, Truth Equipment, China

Preet Yadav, NXP Semiconductors, India

Publicity Co-Chairs

Caoyu Li, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Chaoyue Zheng, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Publication Committee Chair

Mengqi Zhou, IEEE China Council, China

Publication Committee Co-chairs

Lobna A. Said, Nile University, Egypt

Guoqing Deng, Sichuan Institute of Electronics, China

Treasurer

Jianhong Zhou, Xihua University, China

Secretary General

Tiantian Han, Yangtze Delta Region Institute of University of Electronic Science and Technology of China, Huzhou, China

Technical Program Committee

Theme 1: Digital & System Level IC

Chair: Yuchao Yang, Peking University, China

Co-Chair: Hailong Jiao, Peking University, China

Track 1: Digital Architectures & Systems

Chair: 

Zhiyi Yu, Sun Yat-sen University, China

Co-Chairs: 

Yaoyu Tao, Peking University, China

Hongyang Jia, Tsinghua University, China

Track 2: Digital Circuits

Chair: 

Yongpan Liu, Tsinghua University, China

Co-Chairs: 

Yanan Sun, Shanghai Jiao Tong University, China

Fengbin Tu, Hong Kong University of Science and Technology, China

Track 3: Design Methodology & EDA

Chair:

Jun Yang, Southeast University, China

Co-Chairs:

Yibo Lin, Peking University, China

Yu Li, Zhejiang University, China

Theme 2: Analog

Chair: Jing Jin, Shanghai Jiao Tong University, China

Co-Chair: Zheng Wang, University of Electronic Science and Technology of China, China

Track 4: RF & Wireless

Chair:

Keping Wang, Tianjin University, China

Co-Chairs:

Jian Pang, Shanghai Jiao Tong University, China

Kai Tang, Hunan University, China

Track 5: Wireline

Chair: 

Xiaoyan Gui, Xi'an Jiaotong University, China

Co-Chairs: 

Bingyi Ye, East China Normal University, China

Yuekang Guo, Shanghai Jiao Tong University, China

Track 6: General Analog

Chair: 

Lin Cheng, University of Science and Technology of China, China

Co-Chairs: 

Junmin Jiang, Southern University of Science and Technology, China

Ang Hu, Huazhong University of Science and Technology, China

Theme 3: Devices

Chair: Wentong Zhang, University of Electronic Science and Technology of China, China

Co-Chair: Jin Wei, Peking University, China

Track 7: CMOS Logic Devices & Sensors

Chair:

Heng Wu, Peking University, China

Co-Chairs:

Wang Kang, Beihang University, China

Xiaosheng Zhang, University of Electronic Science and Technology of China, China

Track 8: Power Devices & Power IC

Chair:

Long Zhang, Southeast University, China

Co-Chairs:

Jiafei Yao, Nanjing University of Posts and Telecommunications, China

Zekun Zhou, University of Electronic Science and Technology of China, China

Track 9: Device Reliability & Security

Chair:

Mengyuan Hua, Southern University of Science and Technology, China

Co-Chairs:

Sen Huang, Institute of Microelectronics of Chinese Academy of Sciences, China

Zhao Qi, University of Electronic Science and Technology of China, China

Theme 4: Process & Technologies

Chair: Haifeng Ling, Nanjing University of Posts and Telecommunications, China

Co-Chair: Zhihao Yu, Nanjing University of Posts and Telecommunications, China

Track 10: Semiconductor Process Technologies

Chair:

Bobo Tian, East China Normal University, China

Co-Chairs:

Min Liao, Xidian University, China

Li Zhu, Nanjing University of Posts and Telecommunications, China

Track 11: Optoelectronics and Silicon Photonics Integration

Chair:

Linfeng Sun, Beijing Institute of Technology, China

Co-Chairs:

Ming Xu, Huazhong University of Science and Technology, China

Yuanfang Yu, Nanjing University of Posts and Telecommunications, China

Track 12: Packaging Technologies

Chair:

Jun Zhang, Nanjing University of Posts and Telecommunications, China

Co-Chairs:

Shenyang Mo, NARI Semiconductor R&D Center, China

Pengfei Zhao, Nanjing University of Posts and Telecommunications, China

Special Sessions

Special Session 1: Ferroelectric Materials and Devices

Organizers: Prof. Kechao Tang (Peking University), Prof. Xiao Yu (Xidian University)

Special Session 2: Oxide Semiconductor Devices

Organizers: Dr. Mengwei Si (Shanghai Jiao Tong University), Dr. Sunbin Deng (Huazhong University of Science and Technology)

Special Session 3: Advanced Memory and Computing-In-Memory Circuit Design

Organizers: Assoc.Prof. Chaoyue Zheng (UESTC Yangtze Delta Region Institute), Dr. Yue Zhao (Hefei Normal University)

Special Session 4: Chiplet-based Integrated Systems

Organizers:Prof. Xiaohang Wang (Zhejiang University), Assoc. Prof. Letian Huang (UESTC Yangtze Delta Region Institute)

Paper Submission

Visit the following page to view the detail submission guidelines: https://www.icsict.org/Submission.html

Download the Paper Template through https://www.icsict.org/ICSICT_Paper_Template.docx

Plenary Speakers

Jianjun Luo, Hangzhou Dianzi University, China

Speech Title: Non-Volatile Memory Technology & Application Trends in Industry

Mohamad Sawan, Westlake University, China

Paul Penzes, Qualcomm Technologies, USA

Speech Title: Engineering the Future: How AI Is Transforming Hardware Design

Wai Tung Ng, University of Toronto, Canada

Speech Title: 3D Hetero-Integration of WBG Power Modules with Silicon-based Smart Power ICs

Zewen Liu, Tsinghua University, China

Speech Title: GaN-MEMS Sensor and Its Application

Contact Us

Conference Secretary: Ms. Joyce

Phone: +86-186 282 638 76 

Email: [email protected] | [email protected]