International Conference on Smart Materials Applications on January 28-30, 2026 in Tokyo, Japan

International Conference on Smart Materials Applications on January 28-30, 2026 in Tokyo, Japan

Conference Proceedings:

All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, Indexed by Elsevier: SCOPUS.

 

Submission Link:

http://confsys.iconf.org/submission/icsma2026

 

Page Requirements:

Each paper should have no less than 5 pages normally, including all figures, tables, and references.

One regular registration is within SIX Pages. Extra pages will be charged.  

 

Contact:

Conference Secretary: Ms. Loey Liu

Email: [email protected]

Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China)

 

Call for Papers:

Topics of interest for submission include, but are not limited to: Materials Science and Engineering, Materials Properties, Measuring Methods and Applications, Methodology of Research and Analysis and Modeling, Materials Manufacturing and Processing. More information plz visit http://www.icsma.org/

 

Name: South Asia Institute of Science and Engineering
Website: http://www.saise.org/

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