International Conference on Smart Materials Applications on January 19-21, 2026 in Tokyo, Japan

International Conference on Smart Materials Applications on January 19-21, 2026 in Tokyo, Japan

Conference Proceedings:

All submissions will be peer reviewed, the registered and presented papers will be published into Conference Proceedings, Indexed by Elsevier: SCOPUS.

 

Submission Link:

http://confsys.iconf.org/submission/icsma2026

 

Page Requirements:

Each paper should have no less than 5 pages normally, including all figures, tables, and references.

One regular registration is within SIX Pages. Extra pages will be charged.

 

For any inquiry about the conference, please feel free to contact:

Conference Secretary: Ms. Loey Liu

Email: [email protected]

Tel: +852-36789835 (Hong Kong) / +86-15008402564 (China)

 

 

Call for Papers:

Topics of interest for submission include, but are not limited to: Materials Science and Engineering, Materials Properties, Measuring Methods and Applications, Methodology of Research and Analysis and Modeling, Materials Manufacturing and Processing. More information plz visit http://www.icsma.org/ 

Name: South Asia Institute of Science and Engineering
Website: http://www.saise.org/

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