International Conference on Simulation of Semiconductor Devices and Processes ICSSDP on March 25-26, 2024 in Tokyo, Japan
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- Short Name: ICSSDP
- Event Type: Conference
- Presentation: Physical
- Website URL: https://waset.org/simulation-of-semiconductor-devices-and-processes-conference-in-march-2024-in-tokyo
- Program URL: https://waset.org/conferences-in-march-2024-in-tokyo/program
- Location: Tokyo, Japan
- Date: March 25-26, 2024
- Organization: World Academy of Science, Engineering and Technology
- Conference Tags: semiconductors simulation
Modeling and simulation of all sorts of semiconductor devices
FinFETs, GAA FETs, ultra-thin SOI devices
Emerging memory devices
New-material-based nanodevices and optoelectronic devices
TFTs, sensors, power electronic devices and spintronic devices
Tunnel FETs, SETs, organic electronic devices, and bioelectronic devices
Modeling and simulation of all sorts of semiconductor processes
First-principles material design and growth simulation of nano-scale fabrication
Fundamental aspects of device modeling and simulation
Quantum transport
Thermal transport
Fluctuation, noise and reliability
Compact modeling for circuit simulation
Low-power, high frequency and power electronics applications
Process/device/circuit co-simulation in context with system design and verification
Equipment, topography, lithography modeling
Interconnect modeling, including noise and parasitic effects
Numerical methods and algorithms, including grid generation, user-interface, and visualization
Metrology for the modeling of semiconductor devices and processes
FinFETs, GAA FETs, ultra-thin SOI devices
Emerging memory devices
New-material-based nanodevices and optoelectronic devices
TFTs, sensors, power electronic devices and spintronic devices
Tunnel FETs, SETs, organic electronic devices, and bioelectronic devices
Modeling and simulation of all sorts of semiconductor processes
First-principles material design and growth simulation of nano-scale fabrication
Fundamental aspects of device modeling and simulation
Quantum transport
Thermal transport
Fluctuation, noise and reliability
Compact modeling for circuit simulation
Low-power, high frequency and power electronics applications
Process/device/circuit co-simulation in context with system design and verification
Equipment, topography, lithography modeling
Interconnect modeling, including noise and parasitic effects
Numerical methods and algorithms, including grid generation, user-interface, and visualization
Metrology for the modeling of semiconductor devices and processes
Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE