International Conference on Radio-Frequency Integration Engineering and Applications ICRFIEA on January 07-08, 2023 in Tokyo, Japan

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International Conference on Radio-Frequency Integration Engineering and Applications (ICRFIEA) January 07, 2023 - Tokyo, Japan
Radio-Frequency Integration Technology
Device Technologies: CMOS, SOI, LDMOS, SiGe, GaAs, InP, GaN, MEMS, reliability, characterization, etc.
Modeling and CAD: Active/Passive device modeling, CAD, EM simulation, co-simulation, etc.
Packaging technology: MCM, SiP, TSV, flip chip assembly, wire bonding, anisotropic conductive film, etc.
Passive Circuits and Antenna: on-chip antennas, integrated passive devices, ferrite, piezoelectric material, etc.
Frequency Generation and Conversion ICs: VCOs, PLLs, synthesizers, ADPLLs, frequency dividers/multipliers, mixers, etc.
Front-end RFICs: LNAs, VGAs, phase shifters, RF switches, etc.
Power ICs: power amplifiers, linearization circuits, drivers, etc.
Millimeter-wave and THz ICs: circuits operating at mm-wave (30-300 GHz) and sub-mm-wave (>300 GHz) bands.
Analog and Mixed Signal ICs: ADC, DAC, comparators, filters, AGC/VGA, etc.
High-Speed Data Transceivers: wireless/wireline/optical transceivers, CDRs for high-speed data links.
RF Sensor ICs: automotive radars, wearable devices, security, biomedical and healthcare applications, etc.
Power Transmission ICs: RFIDs, electric coupling, electromagnetic induction, magnetic resonance, wireless power transmission ICs, etc.
Emerging ICs: power management, digital RF circuits/architectures, RF BIST, reconfigurable and tunable ICs, new energy vehicle electronics EM and ICs, etc.

Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE

World Academy of Science, Engineering and Technology is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program.