International Conference on Microstructure and Materials Properties ICMMP on September 27-28, 2025 in Hong Kong, China

International Conference on Microstructure and Materials Properties ICMMP on September 27-28, 2025 in Hong Kong, China

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International Conference on Microstructure and Materials Properties (ICMMP) September 27, 2025 - Hong Kong, China
Materials'properties improvement, special properties, advanced techniques
Mechanical/physical/nondestructive testing, characterisation
Integrity after mechanical machining/heat treating/surface modification
Creep/fatigue testing, failure analysis, fractures
Surface characterisation, chemical analysis, microanalysis
Precipitation/dispersion/strain hardening, dislocation interactions
Deformation-induced distortion, structure formation in deformed metals/alloys
Plastic/cyclic strain, quenching/distortion of steels, static/fatigue strength
Analytical representation of creep curves
Quantitative microscopy, particle size distribution, metal/alloy properties
Chemical/heat treatment of metals/alloys, solute strengthening
Polymers/metals/ceramics interface, mould/metal interface, casting/forging quality
Laser/electron beam surface engineering/modification
Solid/liquid interface morphologies vs solidification rate
Microstructure formation modelling/evaluation, metals/alloys simulation

Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE

World Academy of Science, Engineering and Technology is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program.
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