International Conference on Mechanical Engineering, Materials and Automation Technology MMEAT on June 05-07, 2026 in Beijing, China

2026 12th International Conference on Mechanical Engineering, Materials and Automation Technology (MMEAT 2026) will be held in Beijing, China from June 5 to 7, 2026.

Conference Website: https://ais.cn/u/nuYFjm

---Call For Papers---

The topics of interest for submission include, but are not limited to:

◕Mechanical Automation

CNC technology and CNC system

Intelligent manufacturing technology

Test techniques and troubleshooting

Computer Integrated Manufacturing Systems (CIMS)

Molding manufacturing and automation

Instrument Science and Technology

Fluid Machinery and Engineering

Mechatronics

Automatic control and technology

Automated instrumentation and equipment

Factory modeling and automation

Circuits and systems

Communications and Information Systems

Electronic systems

Human-computer interaction and mechatronic engineering

◕Control, Automation and Information Technology

Control System Modeling and Simulation technology

Intelligent Optimization Algorithms and Applications

Fluid Power Transmission and Control

Production Process Simulation

Network Control

Electric Automation

Vehicle Control Systems

Computer Integrated Manufacturing

Microelectronics Technology

Embedded Systems

The Photoelectron IT and System

Intelligent Traffic Control

Computer System Structure

◕Advanced Materials

Nanomaterials and Nanotechnology

Semiconductor Materials and Devices

Electronic Packaging and Interconnection Technology

Flexible electronics and smart wearable devices

High Frequency Electronic Materials and Applications

Electronic ceramics and catalytic materials

Photoelectric materials and LED technology

Thermoelectric materials and thermal management

Technology Battery Technology and Energy Storage

New display technology and materials

Optoelectronics and Microelectronic Materials

Optoelectronic display materials

Semiconductor Materials and Semiconductor Lighting

Power Laser Materials and Devices

Advanced Packaging Materials and Technologies

Solar cell materials

Electromagnetic Compatibility Technology and Materials

Materials and Devices for High Frequency and Ultra High Frequency Communication

---Publication---

All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

---Important Dates---

Full Paper Submission Date: April 22, 2026

Registration Deadline: May 29, 2026

Final Paper Submission Date: May 5, 2026

Conference Dates: June 5-7, 2026

--- Paper Submission---

Please send the full paper(word+pdf) to Submission System: 

https://ais.cn/u/nuYFjm