International Conference on Mechanical and Electronics Engineering ICMEE on May 10-12, 2021 in Osaka, Japan

International Conference on Mechanical and Electronics Engineering ICMEE on May 10-12, 2021 in Osaka, Japan

International Conference on Mechanical and Electronics Engineering (ICMEE) May 10, 2021 - Osaka, Japan

Conference Proceedings:

Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc

 

Conference Chairs :

John Mo, Royal Melbourne Institute of Technology, Australia 

Shih-Chieh Lin, National Tsing-Hua University, Taiwan

Program Chairs :

Xingjian Jing, The Hong Kong Polytechnic University, Hong Kong 

Yu-Liang Chen, National Defense University, Taiwan

 

Contact:

Ms. Serene Lo

[email protected]

+86-028-83208181

Mechanical Engineering

Acoustics and Noise Control Marine System Design

Aerodynamics Material Engineering

Applied Mechanics Material Science and Processing

Automation, Mechatronics and Robotics Mechanical Design

Automobiles Mechanical Power Engineering

Automotive Engineering Mechatronics

Ballistics MEMS and Nano Technology

Biomechanics Multibody Dynamics

Biomedical Engineering Nanomaterial Engineering

CAD/CAM/CIM New and Renewable Energy

CFD Noise and Vibration

Composite and Smart Materials Noise Control

Compressible Flows Non-destructive Evaluation

Computational Mechanics Nonlinear Dynamics

Name: The SCIence and Engineering Institute
Website: http://www.sciei.org/

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