International Conference on Mechanical and Electronics Engineering ICMEE on May 10-12, 2021 in Osaka, Japan
- Short Name: ICMEE
- Event Type: Conference
- Presentation: Physical
- Website URL: http://icmee.org/
- Program URL: http://icmee.org/program.html
- Contact URL: http://icmee.org/contact.html
- Contact E-mail: [email protected]
- Location: Osaka, Japan
- Date: May 10-12, 2021
- Final Submission: April 10, 2021
- Organization: The SCIence and Engineering Institute
- Conference Tags: mechanical engineering electronics engineering industrial electronics electronics mechanical design scopus
Conference Proceedings:
Accepted papers can be published in * ICMEE IOP proceedings * and indexed by *EI Compendex, Scopus*, etc
Conference Chairs :
John Mo, Royal Melbourne Institute of Technology, Australia
Shih-Chieh Lin, National Tsing-Hua University, Taiwan
Program Chairs :
Xingjian Jing, The Hong Kong Polytechnic University, Hong Kong
Yu-Liang Chen, National Defense University, Taiwan
Contact:
Ms. Serene Lo
+86-028-83208181
Mechanical Engineering
Acoustics and Noise Control Marine System Design
Aerodynamics Material Engineering
Applied Mechanics Material Science and Processing
Automation, Mechatronics and Robotics Mechanical Design
Automobiles Mechanical Power Engineering
Automotive Engineering Mechatronics
Ballistics MEMS and Nano Technology
Biomechanics Multibody Dynamics
Biomedical Engineering Nanomaterial Engineering
CAD/CAM/CIM New and Renewable Energy
CFD Noise and Vibration
Composite and Smart Materials Noise Control
Compressible Flows Non-destructive Evaluation
Computational Mechanics Nonlinear Dynamics
Name: The SCIence and Engineering Institute
Website: http://www.sciei.org/
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