International Conference on Integrated Circuits and Microsystems on October 17-19, 2025 in Hefei, China

International Conference on Integrated Circuits and Microsystems on October 17-19, 2025 in Hefei, China

Publication:

The accepted and registered papers will be publication in Conference Proceedings, which will be indexed by EI Compendex, Scopus, etc.

ICICM2016-2024 has been successfully indexed by EI Compendex and Scopus already!

Selected papers will be recommended to JOURNAL OF ELECTRONICS & INFORMATION TECHNOLOGY (EI Compendex & ESCI indexing)

 

Advisory Chairs:

Junfa Mao, Shenzhen University, China

Yue Hao, Xidian University, China

 

Conference Chairs:

Zhigong Wang, Southeast University, China

Ning Xu, Wuhan University of Technology, China

 

Conference Co-Chairs:

Yu Wang,Tsinghua University,China

Letian Huang, University of Electronic Science and Technology of China, China

 

Program Chairs:

Jiliang Zhang, Hunan University, China

Ying Wang, Institute of Computing Technology, Chinese Academy of Sciences, China

Sheng Chang, Wuhan University, China

Yingmei Chen, Southeast University, China

Xiulong Wu, Anhui University, China

Zhikuang Cai, Nanjing University of Posts and Telecommunications, China

Zhuo Zou, Fudan University, China

Jianguo Hu, Sun Yat-sen University , China

Bei Yu,The Chinese University of Hong Kong, China

 

Program Co-Chairs:

Junyong Deng, Xi'an University of Posts & Telecommunications, China

Jun Xu, Nanjing University, China

Zhixiong Di, Southwest Jiaotong University, China

Guojie Luo, Peking University, China

Xiaojun Zhai, University of Essex, UK

Wei Xing, The University of Sheffield, UK

 

Program Committee:

Shi Pu, Wuhan University of Technology , China

Haizhi Song, University Of Electronic Science And Technology Of China, China

Lu Zhu, Sun Yat-sen University, China

Youming Zhang, Southeast University, China

Jianshi Tang, Tsinghua University, China

Weiguang Sheng, Shanghai Jiao Tong University, China

Hao Gao, Austria & Eindhoven University of Technology, The Netherland

Yun Fang, Silicon Austria Labs, Austria

Jeff Kilby, Auckland University of Technology, New Zealand

Zhijun Zhou, Southeast University, China

Xingyuan Tong, Xi`an University Of Posts & Telecommunications, China

Wei Hu, Northwestern Polytechnical University, China

 

Local Chair:

Bowen Jia, Wuhan University of Technology , China

 

Student Program Chairs:

Keping Wang, Tianjin University, China

Delong Shang, Institute of Microelectronics of the Chinese Academy of Sciences, China

Fanyi Meng, Tianjin University, China

 

Student Program Committee:

Li Du, Nanjing University, China

Lei Wang, Nanjing University Of Posts And Telecommunications, China

Xianbo Li, Sun Yat-sen University, China

Tiehu Li, Chongqing University of Technology, China

Moufu Kong, University of Electronic Science and Technology of China, China

Jiaxin Liu, University of Electronic Science and Technology of China, China

Maliang Liu, Xidian University, China

More Organizing Committee list, please visit: https://icicm.net/committee.html

 

History:

ICICM2016 | Chengdu on November 23-25, 2016

ICICM2017 | Nanjing on November 8-11, 2017

ICICM2018 | Shanghai on November 24-26, 2018

ICICM2019 | Beijing on October 25-27,2019

ICICM2020 | Nanjing on October 23-25, 2020

ICICM2021 | Nanjing on October 22-24, 2021

ICICM2022 | Xi'an on October 28-31, 2022

ICICM2023 | Nanjing on October 20-23, 2023

ICICM2024 | Wuhan on October 25-27, 2024

 

Contact us:

Ms. Mila Xiao

Email: [email protected]

Web: http://icicm.net/

Tel: (86)134-0855-5552

Track 1: Electronic Design Automation (EDA)

• Progress of EDA algorithms

• EDA for emerging technologies

• Hardware-software co-design with EDA

• EDA in High Performance Computing (HPC)

• EDA in analog and mixed-signal design

 

Track 2: Integrated Circuit and System Design

• Digital, analog, mixed-signal IC and SOC design technology

• IC computer-aided design technology, DFM

• Modeling and simulation

 

Track 3: Semiconductor Devices and Circuits

• Components and circuits for wireless systems

• Low power, RF devices and circuits

• Silicon/Germanium Devices and Device Physics

• Compound semiconductor devices and circuits

 

Track 4: Process Technology and Manufacturing

• Silicon integrated circuits and manufacturing

• Interconnect, low-K, high-K and other process technologies

• Packaging and testing technology, equipment technology

For more topics, please visit at: http://icicm.net/call-for-papers.html

 

Name: youngnd

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