International Conference on Integrated Circuit Design and Technology ICICDT on October 25-26, 2026 in Osaka, Japan

Advanced materials and processing technologies
Advanced transistor and interconnect structures
Three-dimensional (3D) integration
Variation-tolerant designs
Process and design techniques for soft errors, plasma-induced damage, and reliability
Advanced memory devices and circuits
RF, analog, mixed signal, and I/O circuits for future technology generations
Simulation and modeling of advanced processes, devices, and circuits
EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
Design for manufacturing, yield, and test
System-on-Chip (SoC) and system-in-package (SiP) design integration
Power semiconductor technologies and circuits
Emerging technologies and circuits