International Conference on Integrated Circuit Design and Technology ICICDT on October 25-26, 2025 in Osaka, Japan
Submit Your Paper- Short Name: ICICDT
- Event Type: Conference
- Presentation: Physical
- Website URL: https://waset.org/integrated-circuit-design-and-technology-conference-in-october-2025-in-osaka
- Program URL: https://waset.org/conferences-in-october-2025-in-osaka/program
- Contact URL: https://waset.org
- Location: Osaka, Japan
- Date: October 25-26, 2025
- Final Submission: September 24, 2025
- Notification: April 15, 2024
- Organization: World Academy of Science, Engineering and Technology
- Conference Tags: microcontrollers computer architecture microprocessors electronic packaging very large scale integration (vlsi) reconfigurable computing
Advanced materials and processing technologies
Advanced transistor and interconnect structures
Three-dimensional (3D) integration
Variation-tolerant designs
Process and design techniques for soft errors, plasma-induced damage, and reliability
Advanced memory devices and circuits
RF, analog, mixed signal, and I/O circuits for future technology generations
Simulation and modeling of advanced processes, devices, and circuits
EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
Design for manufacturing, yield, and test
System-on-Chip (SoC) and system-in-package (SiP) design integration
Power semiconductor technologies and circuits
Emerging technologies and circuits
Advanced transistor and interconnect structures
Three-dimensional (3D) integration
Variation-tolerant designs
Process and design techniques for soft errors, plasma-induced damage, and reliability
Advanced memory devices and circuits
RF, analog, mixed signal, and I/O circuits for future technology generations
Simulation and modeling of advanced processes, devices, and circuits
EDA and design optimizations across system, circuit, and/or device levels for high performance, energy efficiency, yield, and/or reliability
Design for manufacturing, yield, and test
System-on-Chip (SoC) and system-in-package (SiP) design integration
Power semiconductor technologies and circuits
Emerging technologies and circuits
Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE
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