International Conference on Encapsulation Technologies for Electronic Applications ICETEA on May 24-25, 2023 in London, United Kingdom
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- Short Name: ICETEA
- Event Type: Conference
- Website URL: https://waset.org/encapsulation-technologies-for-electronic-applications-conference-in-may-2023-in-london
- Program URL: https://waset.org/conferences-in-may-2023-in-london/program
- Contact URL: https://waset.org
- Location: London, United Kingdom
- Date: May 24-25, 2023
- Final Submission: April 23, 2023
- Notification: February 27, 2022
- Organization: World Academy of Science, Engineering and Technology
- Conference Tags: encapsulation
Encapsulation technologies for electronic applications
Electronic packaging
Encapsulated microelectronic packages
Plastic encapsulation methods and encapsulant materials
Market conditions and manufacturers of encapsulant materials
Environmentally friendly or green encapsulants
Encapsulation process technology
Printing encapsulation technology
Characterization of encapsulant properties
Encapsulation defects and failures
Electronic equipment packaging
Advanced packaging
TSV/WAFER level packaging
Interconnection technologies
Emerging packaging technologies
Materials and substrates/leadframes
Processes and automation/equipments
Electrical modeling and simulations
Mechanical modeling and simulations
Thermal characterization and cooling solutions
Quality and reliability
Sheet metal
Cast metal
Machined metal
Molded plastic
Potting
Porosity sealing or impregnation
Liquid filling
Conformal coating
Glop-top
Hermetic metal/glass cases
Hermetic ceramic packages
Printed circuit assemblies
Electronic packaging
Encapsulated microelectronic packages
Plastic encapsulation methods and encapsulant materials
Market conditions and manufacturers of encapsulant materials
Environmentally friendly or green encapsulants
Encapsulation process technology
Printing encapsulation technology
Characterization of encapsulant properties
Encapsulation defects and failures
Electronic equipment packaging
Advanced packaging
TSV/WAFER level packaging
Interconnection technologies
Emerging packaging technologies
Materials and substrates/leadframes
Processes and automation/equipments
Electrical modeling and simulations
Mechanical modeling and simulations
Thermal characterization and cooling solutions
Quality and reliability
Sheet metal
Cast metal
Machined metal
Molded plastic
Potting
Porosity sealing or impregnation
Liquid filling
Conformal coating
Glop-top
Hermetic metal/glass cases
Hermetic ceramic packages
Printed circuit assemblies
Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE