International Conference on Electronics Packaging Technology ICEPT on October 07-08, 2025 in New York, United States

International Conference on Electronics Packaging Technology ICEPT on October 07-08, 2025 in New York, United States

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International Conference on Electronics Packaging Technology (ICEPT) October 07, 2025 - New York, United States
Electronics packaging technology
Advanced packaging
TSV/WAFER level packaging
Interconnection technologies
Emerging packaging technologies
Materials and substrates/leadframes
Processes and automation/equipments
Electrical modeling and simulations
Mechanical modeling and simulations
Thermal characterization and cooling solutions
Quality and reliability
Sheet metal
Cast metal
Machined metal
Molded plastic
Potting
Porosity sealing or impregnation
Liquid filling
Conformal coating
Glop-top
Hermetic metal/glass cases
Hermetic ceramic packages
Printed circuit assemblies

Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE

World Academy of Science, Engineering and Technology is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program.
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