International Conference on Electronic Encapsulation Technologies ICEET on July 12-13, 2024 in Ottawa, Canada

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International Conference on Electronic Encapsulation Technologies (ICEET) July 12, 2024 - Ottawa, Canada
Encapsulation technologies for electronic applications
Electronic packaging
Encapsulated microelectronic packages
Plastic encapsulation methods and encapsulant materials
Market conditions and manufacturers of encapsulant materials
Environmentally friendly or green encapsulants
Encapsulation process technology
Printing encapsulation technology
Characterization of encapsulant properties
Encapsulation defects and failures
Electronic equipment packaging
Advanced packaging
TSV/WAFER level packaging
Interconnection technologies
Emerging packaging technologies
Materials and substrates/leadframes
Processes and automation/equipments
Electrical modeling and simulations
Mechanical modeling and simulations
Thermal characterization and cooling solutions
Quality and reliability
Sheet metal
Cast metal
Machined metal
Molded plastic
Potting
Porosity sealing or impregnation
Liquid filling
Conformal coating
Glop-top
Hermetic metal/glass cases
Hermetic ceramic packages
Printed circuit assemblies

Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE

World Academy of Science, Engineering and Technology is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program.