International Conference on Electron Devices and Applications ICEDA on December 11-13, 2026 in Shenzhen, China - Conference Index

International Conference on Electron Devices and Applications ICEDA on December 11-13, 2026 in Shenzhen, China

International Conference on Electron Devices and Applications (ICEDA) December 11, 2026 - Shenzhen, China

Publication:

All papers will be strictly double blind reviewed by the program committee and reviewers, and accepted papers after proper registration and presentation will be published in the International Conference Proceedings.


Submission Instructions:

1. English is the official language. Paper should be written and presented only in English.

2. If you want to make a presentation and publish your paper, submit a full paper (5-6 pages, two columns); just want to make a presentation, abstract (200-400 words) is enough.

3. If the length of the full paper exceeds 6 pages, extra page will be charged at 60 USD/400 RMB/Page.

4. Submission:

  1) By online submission system: https://confsys.iconf.org/submission/iceda2026

  2) By Email: [email protected]

  3) Template: Please format your paper according to the template (https://www.iceda.org/download/template.docx) before submission.


General Program:

The detailed conference program is to be available online at the late of November 2026. For your convenience, schedule at a glance is given below.

Day 1 - December 11, 2026

  -10:00-17:00 | Onsite Registration & Materials Collection

Day 2 - December 12, 2026

  -09:00-12:00 | Opening Remark and Keynote Speeches

  -12:00-13:30 | Lunch

  -13:30-18:00 | Parallel Sessions

  -18:00-19:30 | Dinner Banquet

Day 3 - December 13, 2026

  -09:00-15:00 | Parallel Sessions


Contact us:

Conference secretary: Miss Adela Zhong

Email: [email protected]

Tel: +86-19180927671

Website: https://www.iceda.org/


Topics (Topics of interest for submission include, but are not limited to:)

Track 1: Semiconductor Devices & Materials

Advanced semiconductor materials (SiC, GaN, 2D materials)

High-performance transistors (FinFET, GAA, TFET)

Power semiconductor devices and modules

MEMS/NEMS devices and sensors


Track 2: Integrated Circuits & VLSI Design

Analog/mixed-signal IC design

RF and millimeter-wave integrated circuits

Low-power and energy-efficient ICs

3D/heterogeneous integration technologies


Track 3: Optoelectronics & Photonic Devices

Photodetectors and image sensors

LEDs, lasers, and display technologies

Silicon photonics and plasmonics

Optical communication devices


Track 4: Power Electronics & Energy Devices

Power converters and inverters

Energy harvesting devices and systems

Battery management systems (BMS)

Electric vehicle power electronics


Track 5: Emerging Technologies & Applications

Quantum computing devices

Bioelectronics and implantable devices

Wearable and IoT sensor technologies

Printed and large-area electronics


Track 6: Device Modeling, Fabrication & Reliability

Circuits, Devices and Systems

Compact modeling of electron devices

Process simulation and TCAD tools

Advanced lithography and nanofabrication

For more topics, please visit: https://www.iceda.org/cfp.html.


Name: International Association of Computer Science and Information Technology
Website: http://www.iacsit.org/

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