International Conference on Electrical and Electronics Engineering EEEN on July 29-30, 2026 in Aberglasslyn, Australia

Topics include, but are not limited to, the following:

Next Generation Electronics, Devices and Materials

 Advanced Semiconductor Devices

 VLSI, 3D ICs and Heterogeneous Integration

 Advanced Packaging andChiplet Architectures

 Nanoelectronics and Quantum Devices

 Silicon Photonics and Optoelectronics

 Flexible, Wearable and Bio Integrated Electronics

Power Electronics, Energy Systems and Sustainability

 Power Electronics and Integrated Power Modules

 Electric Vehicles, Charging and Transportation Electrification

 Smart Grids, Microgridsand DER Integration

 Energy Storage, Battery Systems and Digital Twins

 High Voltage Engineering and Protection

 Sustainable and Carbon Aware Energy Systems

AI, Computing Systems and Intelligent Hardware

 AI Hardware Acceleration

 AI Driven Electronic Design Automation (AI EDA)

 Generative AI for Engineering and System Design

 Edge AI, TinyMLand Low Power Intelligence

 High Performance and Cloud Scale Computing

 Bio Inspired and Neuromorphic Computing

 Secure and Trusted Hardware

 Sustainable and Green Computing

Signal Processing, Machine Learning and Data Intelligence

 Advanced Signal, Image and Speech Processing

 ML/AI for Engineering Systems

 Optimization, Metaheuristics and Intelligent Algorithms

 Data Fusion, Multimodal Analytics and Digital Twins

Communication Systems, Networks and 6G Technologies

 6G and Beyond Wireless Systems

 AI Native Wireless Networks

 Joint Communication and Sensing (JCAS / ISAC)

 RF, mmWaveand THz Circuits

 Optical Communication and Photonic Networks

 Satellite, UAV and Space Communications

Cybersecurity, Networks and Information Systems

 Network Security and Privacy

 Cybersecurity for Embedded and CPS

 Secure Federated Learning and Distributed AI

 Resilient Network Architectures

Robotics, Automation and Cyber Physical Systems

 Autonomous Robotics and Intelligent Systems

 Cyber Physical Systems and Digital Twins

 AI Driven Robotics Simulation and Control

 Advanced Control Systems

 Human–Robot Interaction

 Mechatronics and Avionics

Sensing, Instrumentation and Embedded Systems

 Smart Sensors andIoT Systems

 Embedded and Real Time Systems

 Remote Sensing and Geospatial Intelligence

 Quantum Sensing and Precision Measurement

 Space Electronics and Radiation Hardened Systems

Biomedical Engineering and Healthcare Technologies

 Biomedical Signal and Image Processing

 Wearable, Implantable and Assistive Devices

 Neural Engineering and Brain–Machine Interfaces

 AI Enabled Healthcare and Digital Medicine

 Bioinformatics and Computational Biology

Electromagnetics, Thermal Management and Emerging Interdisciplinary Areas

 Electromagnetic Compatibility and Interference

 Thermal Management, Cooling and Reliability

 Quantum Communication and Computing

 Electro Optic Co Design

Paper Submission

Authors are invited to submit papers through the conference Submission System by June 20, 2026. Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Emerging Trends in Electrical, Electronics & Instrumentation Engineering: An International Journal (EEIEJ) https://airccse.com/eeiej/ (Confirmed).

Important Dates

• Submission Deadline : July 04, 2026 

• Authors Notification : July 15, 2026 

• Registration & Camera-Ready Paper Due : July 18, 2026

Contact Us

For any queries related to the conference, contact:

Email: [email protected]

Submission System URL: https://eeen2026.org/submission/index.php

Name: eeen
Website: https://eeen2026.org/index
Address: austr