International Conference on Edible Food Packaging Industry and Nanotechnology ICEFPIN on June 28-29, 2021 in Istanbul, Turkey

Name: International Conference on Edible Food Packaging Industry and Nanotechnology
Start: 2021-06-27T21:00:00.000000Z
End: 2021-06-28T21:00:00.000000Z
Location: Istanbul, Turkey

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Short Name: ICEFPIN
Event Type: Conference
Website URL: https://waset.org/edible-food-packaging-industry-and-nanotechnology-conference-in-june-2021-in-istanbul
Contact URL: https://panel.waset.org/Support
Location: Istanbul, Turkey
Date: June 28-29, 2021
Final Submission: May 27, 2021
Notification: December 17, 2019
Organization: World Academy of Science, Engineering and Technology
Conference Tags: food food nanotechnology food packaging

Description
Organization

Edible food packaging
Edible and biodegradable food packaging
Active and smart edible packaging
Edible food packaging and sustainability
Edible food components
Materials and processing technologies
Nanotechnology and edible packaging
Application of bioactive compounds
Food packaging applications
Principles and practice
Eco-friendly technology
Edible films
Edible protein films
Edible food packaging industry
Green marketing strategy
Edible food packaging made from milk proteins
Antimicrobial packaging
Reducing packaging waste
Current applications
The future of edible packaging

Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE

World Academy of Science, Engineering and Technology is a federated organization dedicated to bringing together a significant number of diverse scholarly events for presentation within the conference program.

Description	Price	Date
Presenter Sign Up Fee	EUR 350.00	Before May 27, 2021
Listener Sign Up Fee	EUR 250.00	Before May 27, 2021