International Conference on Building Envelope Engineering and Applications ICBEEA on May 27-28, 2024 in Tokyo, Japan
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- Short Name: ICBEEA
- Event Type: Conference
- Presentation: Physical
- Website URL: https://waset.org/building-envelope-engineering-and-applications-conference-in-may-2024-in-tokyo
- Program URL: https://waset.org/conferences-in-may-2024-in-tokyo/program
- Location: Tokyo, Japan
- Date: May 27-28, 2024
- Organization: World Academy of Science, Engineering and Technology
- Conference Tags: engineering applications building engineering
Building envelope
High performance building envelopes
Building envelope engineering
Design of the building envelope
Building envelope materials and products
Building envelope improvements
Types of building envelopes
Building envelope performance assessment
High performance envelope design
Hygrothermal analysis/modeling
Water and air leakage performance testing
Exterior envelope commissioning
2d/3d thermal modeling
Forensic investigation
Air barrier design and testing
Water and water vapor control
Air control
Thermal envelope
Heat transfer through the building enclosure
Building envelope performance factors
High performance building envelopes
Building envelope engineering
Design of the building envelope
Building envelope materials and products
Building envelope improvements
Types of building envelopes
Building envelope performance assessment
High performance envelope design
Hygrothermal analysis/modeling
Water and air leakage performance testing
Exterior envelope commissioning
2d/3d thermal modeling
Forensic investigation
Air barrier design and testing
Water and water vapor control
Air control
Thermal envelope
Heat transfer through the building enclosure
Building envelope performance factors
Name: World Academy of Science, Engineering and Technology
Website: https://waset.org/
Address: UAE